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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
11359734
Filing Dt:
02/22/2006
Publication #:
Pub Dt:
06/29/2006
Inventors:
Steven Reder, Michael Berman
Title:
Process method for achieving uniform stress free electro-polishing across a copper plated wafer
Assignment: 1
Reel/Frame:
017616/0737Recorded: 02/22/2006Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/04/2003
Exec Dt:
06/04/2003
Assignee:
1551 MCCARTHY BOULEVARD
MILPITAS, CALIFORNIA 95035
Correspondent:
TIMOTHY R. CROLL
LEGAL DEPARTMENT - IP
1621 BARBER LANE
MS D-106
MILPITAS, CA 95035
Assignment: 2
Reel/Frame:
020548/0977Recorded: 02/19/2008Pages: 20
Conveyance:
MERGER (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
04/04/2007
Assignee:
1621 BARBER LANE
MILPITAS, CALIFORNIA 95035
Correspondent:
PETER P. SCOTT
4420 ARROWSWEST DR
MS L-203
COLORADO SPRINGS, CO 80907

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