Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11159152
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Filing Dt:
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06/23/2005
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Publication #:
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Pub Dt:
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06/29/2006
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Inventor:
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Chung-Hsing Tzu
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Title:
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Stack chip package
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 17, WU-CHUAN 3 RD. |
| WU-KU HSIANG |
| TAIPEI COUNTY, TAIWAN ROC 248 |
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| JOE MCKINNEY MUNCY |
| BIRCH, STEWART, KOLASCH & BIRCH, LLP |
| 8110 GATEHOUSE RD |
| SUITE 100 EAST, P.O. BOX 747 |
| FALLS CHURCH, VA 22040-0747 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| EQUITY TRUSE CHAMBERS |
| P.O. BOX 3269 |
| APIA, AMERICAN SAMOA |
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| LIN CHI-YUAN |
| 8F., NO. 249-1, SEC. 3, JHONGSIAO E. RD. |
| DA-AN DISTRICT, TAIPEL CITY 106 |
| TAIWAN (R.O.C.) |
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