Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11250989
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Filing Dt:
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10/13/2005
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Publication #:
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Pub Dt:
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07/06/2006
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Inventors:
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Hung-Che Shen, Hung-Hsin Liu, Geng-Shin Shen
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Title:
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Flexible substrate for package
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 1, YANFA 1ST RD. |
| HSINCHU SCIENCE PARK |
| HSINCHU CITY, TAIWAN R.O.C., 300 |
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| CANON'S COURT, 22 VICTORIA STREET |
| HAMILTON, BERMUDA HM12 |
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| ANDREW D. FORTNEY, PH.D. |
| THE LAW OFFICES OF ANDREW D. |
| FORTNEY, PH.D., P.C. |
| 7257 N. MAPLE AVE., SUITE 107 |
| FRESNO, CA 93720 |
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