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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
10/18/2011
Application #:
11287736
Filing Dt:
11/28/2005
Publication #:
Pub Dt:
07/06/2006
Inventors:
Josef Maynollo, Thomas Detzel
Title:
POWER SEMICONDUCTOR COMPONENT HAVING A TOPMOST METALLIZATION LAYER
Assignment: 1
Reel/Frame:
017312/0146Recorded: 03/06/2006Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/01/2006
Exec Dt:
01/07/2006
Assignee:
ST.-MARTIN-STR. 53
81669 MUNICH, GERMANY
Correspondent:
DICKE, BILLIG & CZAJA, P.L.L.C.
FIFTH STREET TOWERS
100 SOUTH FIFTH STREET, SUITE 2250
MINNEAPOLIS, MN 55402

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