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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
08/14/2007
Application #:
11035918
Filing Dt:
01/13/2005
Publication #:
Pub Dt:
07/13/2006
Inventors:
Jonathan A. Noquil, Connie Tangpuz, Venkat Iyer, Romel Manatad, Stephen Martin et al
Title:
METHOD TO MANUFACTURE A UNIVERSAL FOOTPRINT FOR A PACKAGE WITH EXPOSED CHIP
Assignment: 1
Reel/Frame:
020309/0196Recorded: 12/26/2007Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/12/2005
Exec Dt:
01/12/2005
Exec Dt:
01/12/2005
Exec Dt:
01/12/2005
Exec Dt:
01/12/2005
Exec Dt:
01/12/2005
Assignee:
82 RUNNING HILL ROAD
MS 35-4E
SOUTH PORTLAND, MAINE 04106
Correspondent:
PATRICK R. JEWIK
TOWNSEND AND TOWNSEND AND CREW LLP
TWO EMBARCADERO CENTER, EIGHTH FLOOR
SAN FRANCISCO, CALIFORNIA 94111-3834
Assignment: 2
Reel/Frame:
057694/0374Recorded: 08/03/2021Pages: 381
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
07/22/2021
Assignee:
5005 E. MCDOWELL ROAD, MD A700
PHOENIX, ARIZONA 85008
Correspondent:
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD
MD A700
PHOENIX, AZ 85008

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