Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11273890
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Filing Dt:
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11/14/2005
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Publication #:
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Pub Dt:
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07/20/2006
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Inventor:
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Shih-Ping Hsu
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Title:
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Flip-chip package structure with direct electrical connection of semiconductor chip
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 6, LI-HSIN ROAD, SCIENCE-BASED INDUSTRIAL PARK |
HSIN-CHU, TAIWAN (R.O.C.) |
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SAWYER LAW GROUP LLP |
P.O. BOX 51418 |
PALO ALTO, CA 94303 |
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