Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11329223
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Filing Dt:
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01/11/2006
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Publication #:
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Pub Dt:
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07/20/2006
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Inventors:
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Hisae Uchiyama, Naotaka Kinjou, Takashi Kondou, Takahiro Fukuoka, Jun Ishii
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Title:
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Semi-conducting resin composition, and wired circuit board
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-2, SHIMO-HOZUMI 1-CHOME, IBARAKI-SHI |
| OSAKA, JAPAN 567-8680 |
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| AKERMAN SENTERFITT/JEAN C. EDWARDS, ESQ. |
| 801 PENNSYLVANIA AVENUE, NW, SUITE 600 |
| WASHINGTON, DC 20004 |
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