Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/15/2011
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Application #:
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11326149
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Filing Dt:
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01/05/2006
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Publication #:
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Pub Dt:
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07/20/2006
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Inventors:
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Takashi Niwa, Susumu Ichihara, Koichiro Jujo, Hiroyuki Hoshina
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Title:
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ELECTROFORMING MOLD AND METHOD FOR MANUFACTURING THE SAME, AND METHOD FOR MANUFACTURING ELECTROFORMED COMPONENT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8, NAKASE 1-CHOME, MIHAMA-KU, CHIBA-SHI |
| CHIBA, JAPAN 261-8507 |
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| BRUCE L. ADAMS |
| ADAMS & WILKS |
| 17 BATTERY PLACE-SUITE 1231 |
| NEW YORK, NEW YORK 10004 |
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