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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
11100140
Filing Dt:
04/05/2005
Publication #:
Pub Dt:
07/20/2006
Inventors:
Han-Ping Pu, Chun-Chi Ke, Kuo-Jui Tai, Cheng-Hsu Hsiao
Title:
SEMICONDUCTOR ELEMENT WITH UNDER BUMP METALLURGY STRUCTURE AND FABRICATION METHOD THEREOF
Assignment: 1
Reel/Frame:
016461/0021Recorded: 04/05/2005Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/31/2005
Exec Dt:
03/31/2005
Exec Dt:
03/31/2005
Exec Dt:
03/31/2005
Assignee:
NO. 123, SEC. 3
DA FONG ROAD, TANTZU
TAICHUNG HSIEN, TAIWAN
Correspondent:
PETER F. CORLESS
EDWARDS & ANGELL, LLP
P.O. BOX 55874
BOSTON, MA 02205
Assignment: 2
Reel/Frame:
017182/0574Recorded: 01/12/2006Pages: 3
Conveyance:
CORRECTED NOTICE OF RECORDATION OF ASSIGNMENT TO CORRECT THE 3RD ASSIGNOR'S FIRST NAME PREVIOUSLY RECORDED AT REEL 016461 FRAME 0021.
Assignors:
Exec Dt:
03/31/2005
Exec Dt:
03/31/2005
Exec Dt:
03/31/2005
Exec Dt:
03/31/2005
Assignee:
NO. 123, SEC. 3
DA FONG ROAD, TANTZU
TAICHUNG-HSIEN, TAIWAN ROC
Correspondent:
STEVEN M. JENSEN
EDWARDS ANGELL PALMER & DODGE LLP
P.O. BOX 55874
BOSTON, MA 02205

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