Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11100140
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Filing Dt:
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04/05/2005
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Publication #:
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Pub Dt:
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07/20/2006
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Inventors:
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Han-Ping Pu, Chun-Chi Ke, Kuo-Jui Tai, Cheng-Hsu Hsiao
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Title:
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SEMICONDUCTOR ELEMENT WITH UNDER BUMP METALLURGY STRUCTURE AND FABRICATION METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 123, SEC. 3 |
DA FONG ROAD, TANTZU |
TAICHUNG HSIEN, TAIWAN |
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PETER F. CORLESS |
EDWARDS & ANGELL, LLP |
P.O. BOX 55874 |
BOSTON, MA 02205 |
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Assignment:
2
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CORRECTED NOTICE OF RECORDATION OF ASSIGNMENT TO CORRECT THE 3RD ASSIGNOR'S FIRST NAME PREVIOUSLY RECORDED AT REEL 016461 FRAME 0021.
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NO. 123, SEC. 3 |
DA FONG ROAD, TANTZU |
TAICHUNG-HSIEN, TAIWAN ROC |
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STEVEN M. JENSEN |
EDWARDS ANGELL PALMER & DODGE LLP |
P.O. BOX 55874 |
BOSTON, MA 02205 |
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