Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11318670
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Filing Dt:
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12/27/2005
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Publication #:
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Pub Dt:
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07/20/2006
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Inventor:
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Hiroshi Abe
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Title:
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IC token, injection molding die for the IC token manufacturing method for the IC token and an IC token selection device
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-24-15, MINAMI AOYAMA |
| AOYAMA TOWER BLDG., 2F |
| MINATO-KU, TOKYO, JAPAN 107-0062 |
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| JOSEPH W. PRICE, SNELL & WILMER LLP |
| 600 ANTON BOULEVARD |
| SUITE 1400 |
| COSTA MESA, CA 92626-7689 |
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