Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
2
|
|
Patent #:
|
|
Issue Dt:
|
03/03/2009
|
Application #:
|
11335459
|
Filing Dt:
|
01/20/2006
|
|
Publication #:
|
|
Pub Dt:
|
07/27/2006
| | | | |
|
Inventors:
|
Hiroshi Maki, Kazuhiro Seiki, Eiji Wada
|
|
Title:
|
SEMICONDUCTOR MANUFACTURING METHOD OF DIE-PICK-UP FROM WAFER
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 4-1, MARUNOUCHI 2-CHOME, CHIYODA-KU |
| TOKYO, JAPAN |
|
|
|
|
| ANTONELLI TERRY STOUT, ET AL. |
| 1300 NORTH 17TH STREET |
| SUITE 1800 |
| ARLINGTON, VA 22209 |
|
|
|
Assignment:
2
|
|
|
|
|
|
|
MERGER (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 1753 SHIMONUMABE, NAKAHARA-KU |
| KAWASAKI |
| KANAGAWA, JAPAN |
|
|
|
|
| ANTONELLI, TERRY, STOUT & KRAUS, LLP |
| 1300 N. 17TH ST., SUITE 1800 |
| ARLINGTON, VA 22209 |
|
|
Search Results as of:
05/02/2024 03:25 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
