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Patent Assignment Abstract of Title

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Total Assignments: 1

Patent #:	NONE	Issue Dt:		Application #:	11139789	Filing Dt:	05/31/2005
Publication #:	20060169750	Pub Dt:	08/03/2006
Inventors:	Hisao Tanaka, Masanao Fujii, Toru Okada, Yutaka Noda, Susumu Iida, Hirokazu Yamanishi
Title:	Soldering method and apparatus

Assignment: 1

Reel/Frame:

Recorded: 05/31/2005

Pages: 3

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Assignors:

Exec Dt:

04/16/2005

Exec Dt:

04/18/2005

Exec Dt:

04/18/2005

Exec Dt:

04/18/2005

Exec Dt:

04/18/2005

Exec Dt:

04/18/2005

Assignee:

1-1, KAMIKODANAKA 4-CHOME, NAKAHARA-KU, KAWASAKI-SHI

KANAGAWA, JAPAN 211-8588

Correspondent:

WESTERMAN, HATTORI, DANIELS & ADRIAN LLP

1250 CONNECTICUT AVENUE, N.W., SUITE 700

WASHINGTON, D.C. 20036

Domestic rep:

WESTERMAN, HATTORI, DANIELS, ET AL.

1250 CONNECTICUT AVENUE, N.W.

SUITE 700

WASHINGTON, D.C. 20036

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