Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/01/2010
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Application #:
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11339767
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Filing Dt:
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01/25/2006
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Publication #:
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Pub Dt:
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08/03/2006
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Inventors:
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Yasuaki Funo, Yasutaka Nishida, Toshihiko Iwasaki
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Title:
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BUCKLE, INJECTION MOLDING DIE AND INJECTION MOLDING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1, KANDAIZUMI-CHO |
| CHIYODA-KU |
| TOKYO, JAPAN 101-8642 |
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| MICHAEL S. LEONARD |
| EVEREST INTELLECTUAL PROPERTY LAW GROUP |
| P.O. BOX 708 |
| NORTHBROOK, IL 60065 |
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