Patent Assignment Abstract of Title
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For pending or abandoned applications please consult USPTO staff.
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11392731
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Filing Dt:
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03/30/2006
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Publication #:
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Pub Dt:
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08/03/2006
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Inventors:
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Kenichi Nagayama, Kunihiko Shirahata, Takayuki Kitajima, Masaki Komada, Yusuke Nakajima et al
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Title:
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Laminate for forming a substrate with wires, substrate with wires and methods for producing them
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 12-1, YURAKUCHO 1-CHOME, CHIYODA-KU |
| TOKYO 100-8405, JAPAN |
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| 4-1, MEGURO 1-CHOME, MEGURO-KU |
| TOKYO 153-8654, JAPAN |
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| 1105, AZA-NIKKO, OAZA-KUNOMOTO, TENDO-SHI |
| YAMAGATA 994-8585, JAPAN |
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| 2837-11, HACHIMANPARA 4-CHOME, YONEZAWA-SHI |
| YAMAGATA 992-1128, JAPAN |
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| OBLON, SPIVAK, MCCLELLAND, MAIER & NEUST |
| 1940 DUKE STREET |
| ALEXANDRIA, VA 22314 |
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