Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/02/2009
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Application #:
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11223311
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Filing Dt:
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09/09/2005
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Publication #:
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Pub Dt:
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08/10/2006
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Inventors:
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Jae Hak Kim, Sun Jung Lee, Seung Jin Lee
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Title:
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METHODS FOR FORMING DUAL DAMASCENE WIRING FOR SEMICONDUCTOR DEVICES USING PROTECTIVE VIA CAPPING LAYER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 416, MAETAN-DONG, YEONGTONG-GU, KYUNGKI-DO |
| SUWON-CITY, KOREA, REPUBLIC OF |
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| FRANK CHAU |
| F. CHAU & ASSOCIATES, LLC |
| 130 WOODBURY ROAD |
| WOODBURY, NY 11797 |
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