Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11344014
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Filing Dt:
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02/01/2006
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Publication #:
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Pub Dt:
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08/10/2006
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Inventors:
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Hiroki Nakamura, Masaki Kado, Shigeru Aomori
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Title:
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Method of forming copper wiring layer
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 292, YOSHIDA-CHO, TOTSUKA-KU |
| YOKOHAMA-SHI, KANAGAWA 244-0817, JAPAN |
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| OBLON SPIVAK MCCLELLAND MAIER & NEUSTADT |
| 1940 DUKE STREET |
| ALEXANDRIA, VA 22314 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-9-2, HATARA-CHO, FUKAYA-SHI, |
| SAITAMA, JAPAN 366-0032 |
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| OBLON, SPIVAK, ET AL. |
| 1940 DUKE STREET |
| ALEXANDRIA, VA 22314 |
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Assignment:
3
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CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNMENT LANGUAGE PREVIOUSLY RECORDED ON REEL 024819 FRAME 0288. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT OF THE ASSIGNOR'S INTEREST.
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| 1-9-2, HATARA-CHO |
| FUKAYA-SHI, SAITAMA, JAPAN 366-0032 |
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| OBLON, SPIVAK, ET AL |
| 1940 DUKE STREET |
| ALEXANDRIA, VA 22314 |
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