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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
10/26/2010
Application #:
10550153
Filing Dt:
09/20/2005
Publication #:
Pub Dt:
08/17/2006
Inventors:
Toshikazu Okubo, Katsuyoshi Naoi, Yuka Yamada
Title:
METHOD FOR ANALYZING COPPER ELECTROPLATING SOLUTION, APPARATUS FOR THE ANALYSIS, AND METHOD FOR FABRICATING SEMICONDUCTOR PRODUCT
Assignment: 1
Reel/Frame:
017795/0335Recorded: 09/20/2005Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/06/2005
Exec Dt:
09/06/2005
Exec Dt:
09/06/2005
Assignee:
5-1 TAITO 1-CHOME, TAITO-KU
TOKYO, JAPAN
Correspondent:
CAMERON KERRIGAN
SQUIRE, SANDERS & DEMPSEY L.L.P.
ONE MARITIME PLAZA, SUITE 300
SAN FRANCISCO, CA 94111

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