Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11356396
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Filing Dt:
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02/17/2006
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Publication #:
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Pub Dt:
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08/24/2006
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Inventors:
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Kenichi Shirasaka, Hiroshi Saitoh
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Title:
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Lead frame, sensor including lead frame, resin composition to be used for resin mold in the sensor, and sensor including the resin mold
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 10-1, NAKAZAWA-CHO |
| HAMAMATSU-SHI |
| SHIZUOKA-KEN, JAPAN |
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| MICHAEL J. SCHEER |
| DICKSTEIN SHAPIRO MORIN, ET AL. |
| 1177 AVENUE OF THE AMERICAS, 41ST FLOOR |
| NEW YORK, NY 10038-2714 |
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