Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/13/2010
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Application #:
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11356129
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Filing Dt:
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02/17/2006
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Publication #:
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Pub Dt:
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08/24/2006
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Inventor:
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Hironobu Ikeda
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Title:
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HEAT SINK, AN ELECTRONIC COMPONENT PACKAGE, AND A METHOD OF MANUFACTURING A HEAT SINK
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 7-1, SHIBA 5-CHOME, MINATO-KU |
| TOKYO, JAPAN |
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| SEAN M. MCGINN, ESQ., REG. NO. 34,386 |
| MCGINN INTELLECTUAL PROPERTY |
| LAW GROUP, PLLC |
| 8321 OLD COURTHOUSE RD., SUITE 200 |
| VIENNA, VA 22182 |
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