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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
11/06/2007
Application #:
11406743
Filing Dt:
04/18/2006
Publication #:
Pub Dt:
08/24/2006
Inventors:
Brian V. Mech, Robert J. Greenberg, Gregory J. DelMain
Title:
METHOD OF FORMING AN IMPLANTABLE ELECTRONIC DEVICE CHIP LEVEL HERMETIC AND BIOCOMPATIBLE ELECTRONICS PACKAGE USING SOI WAFERS
Assignment: 1
Reel/Frame:
017809/0761Recorded: 04/18/2006Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/21/2005
Exec Dt:
01/05/2006
Exec Dt:
12/22/2005
Assignee:
12744 SAN FERNANDO ROAD
BUILDING 3
SYLMAR, CALIFORNIA 91342
Correspondent:
SECOND SIGHT MEDICAL PRODUCTS, INC.
BUILDING 3
12744 SAN FERNANDO ROAD
SYLMAR, CA 91342

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