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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
11074717
Filing Dt:
03/09/2005
Publication #:
Pub Dt:
08/31/2006
Inventors:
Seiichiro Kanno, Junichi Tanaka, Go Miya, Tsunehiko Tsubone, Toshio Masuda et al
Title:
Apparatus and method for processing wafer
Assignment: 1
Reel/Frame:
016678/0314Recorded: 06/08/2005Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/03/2005
Exec Dt:
03/03/2005
Exec Dt:
03/02/2005
Exec Dt:
03/07/2005
Exec Dt:
03/07/2005
Exec Dt:
03/03/2005
Assignee:
1-24-14 NISHI SHIMBASHI, MINATO-KU
TOKYO 105-8717, JAPAN
Correspondent:
ANTONELLI, TERRY, STOUT ET AL.
1300 NORTH 17TH STREET-SUITE 1800
ARLINGTON, VA 22209

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