Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/25/2007
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Application #:
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11233175
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Filing Dt:
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09/23/2005
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Publication #:
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Pub Dt:
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08/31/2006
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Inventors:
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Hideto Furuyama, Hiroshi Hamasaki
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Title:
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INTERFACE MODULE FOR CONNECTING LSI PACKAGES, AND LSI-INCORPORATING APPARATUS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, SHIBAURA 1-CHOME, MINATO-KU |
| TOKYO 105-8001, JAPAN |
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| OBLON, SPIVAK, MCCLELLAND, MAIER, ET AL |
| 1940 DUKE STREET |
| ALEXANDRIA, VIRGINIA 22314 |
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