Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/08/2011
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Application #:
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11306015
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Filing Dt:
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12/14/2005
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Publication #:
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Pub Dt:
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09/07/2006
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Inventors:
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Yu-Ying Tsai, Shih-Ming Chen, Kuo-Wei Lin
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Title:
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SOLDER BUMP AND RELATED INTERMEDIATE STRUCTURE HAVING PRIMARY AND SECONDARY PORTIONS AND METHOD OF MANUFACTURING SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. 6 |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN |
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| BAKER & MCKENZIE |
| ON BEHALF OF TSMC |
| 2300 TRAMMELL CROW CENTER |
| 2001 ROSS AVENUE, SUITE 2300 |
| DALLAS, TX 75201 |
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