Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11371175
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Filing Dt:
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03/08/2006
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Publication #:
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Pub Dt:
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09/14/2006
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Inventor:
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Dominick Richiuso
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Title:
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Low capacitance solder bump interface structure
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 490 MCCARTHY BOULEVARD |
| SUITE 100 |
| MILPITAS, CALIFORNIA 95035 |
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| DAVID A. JAKOPIN |
| P.O. BOX 10500 |
| PILLSBURY WINTHROP SHAW PITTMAN LLP |
| MCLEAN, VA 22102 |
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Assignment:
2
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| 270 PARK AVENUE |
| NEW YORK, NEW YORK 10017 |
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| IP RESEARCH PLUS, INC. |
| 21 TADCASTER CIRCLE |
| ATTN: PENELOPE J.A. AGODOA |
| WALDORF, MD 20602 |
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