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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
04/01/2008
Application #:
11092266
Filing Dt:
03/29/2005
Publication #:
Pub Dt:
10/05/2006
Inventor:
Tsukasa Matsuda
Title:
METHOD AND SYSTEM FOR FORMING A VARIABLE THICKNESS SEED LAYER
Assignment: 1
Reel/Frame:
016431/0765Recorded: 03/29/2005Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
03/28/2005
Assignee:
3-6 AKASAKA 5-CHOME
TBS BROADCAST CENTER
MINATO-KU, TOKYO, JAPAN 107
Correspondent:
KRISTI L. DAVIDSON, ESQ.
WOOD, HERRON & EVANS, L.L.P.
2700 CAREW TOWER
441 VINE STREET
CINCINNATI, OHIO 45202

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