Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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06/29/2010
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Application #:
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11357115
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Filing Dt:
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02/21/2006
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Publication #:
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Pub Dt:
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10/19/2006
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Inventors:
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Kinya Nakatsu, Satoshi Ibori, Hideki Miyazaki
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Title:
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AN ELECTRIC CIRCUIT MODULE WITH IMPROVED HEAT DISSIPATION CHARACTERISTICS USING A FIXING TOOL FOR FIXING AN ELECTRIC APPARATUS TO A HEAT SINK
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3, KANDANERIBEI-CHO, CHIYODA-KU |
| TOKYO 101-0022, JAPAN |
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| CROWELL & MORING LLP |
| INTELLECTUAL PROPERTY GROUP |
| PO BOX 14300 |
| WASHINGTON, DC 20044-4300 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6-6, MARUNOUCHI 1-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 100-8280 |
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| CROWELL & MORING LLP |
| PO BOX 14300 |
| INTELLECTUAL PROPERTY GROUP |
| WASHINGTON, DC 20044-4300 |
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