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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
10542876
Filing Dt:
11/17/2005
Publication #:
Pub Dt:
10/26/2006
Inventors:
Fumio Kurihara, Haruto Nagakusa
Title:
Injection molding die, injection molding method, and weldless molded product
Assignment: 1
Reel/Frame:
017252/0696Recorded: 11/18/2005Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/20/2005
Exec Dt:
07/20/2005
Assignee:
15-5, SHINTOMI 2-CHOME, CHUO-KU
TOKYO 104-0041, JAPAN
Correspondent:
OBLON, SPIVAK, MCCLELLAND, MAIER & NEUST
1940 DUKE STREET
ALEXANDRIA, VA 22314

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