Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/22/2009
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Application #:
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10547271
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Filing Dt:
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06/05/2006
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Publication #:
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Pub Dt:
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10/26/2006
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Inventor:
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Fui Jin Chai
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Title:
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INTEGRATED CIRCUIT PACKAGE AND METHOD FOR PRODUCING IT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ST. MARTIN-STRASSE 53 |
| 81669 MUNCHEN, GERMANY |
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| HAROLD C. MOORE |
| MAGINOT, MOORE & BECK |
| 111 MONUMENT CIRCLE, SUITE 3000 |
| INDIANAPOLIS, IN 46204-5115 |
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