Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10555856
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Filing Dt:
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11/03/2005
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Publication #:
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Pub Dt:
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11/02/2006
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Inventors:
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Kou Ishii, Yoshiaki Yanagawa, Shigeki Maruyama
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Title:
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Wire material payout device and wire solder
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 7-2, NIHONBASHI KOAMI-CHO, CHUO-KU |
| TOKYO, JAPAN |
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| BRUCE L. ADAMS ESQ. |
| ADAMS & WILKS |
| 17 BATTERY PLACE, SUITE 1231 |
| NEW YORK, NY 10004 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SENJU HASHIDO-CHO 23, ADACHI-KU |
| TOKYO, JAPAN |
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| BRUCE L. ADAMS |
| ADAMS & WILKS |
| 17 BATTERY PLACE |
| SUITE 1231 |
| NEW YORK, NY 10004 |
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