Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
11313679
|
Filing Dt:
|
12/22/2005
|
|
Publication #:
|
|
Pub Dt:
|
11/02/2006
| | | | |
|
Inventors:
|
Chien Liu, Meng-Jen Wang
|
|
Title:
|
Chip package structure and method for manufacturing the same
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 26, CHIN 3RD RD., 811 NANTZE EXPORT PROCESSING ZONE |
| KAOHSIUNG, TAIWAN R.O.C. |
|
|
|
|
| JOE MCKINNEY MUNCY |
| BIRCH, STEWART, KOLASCH & BIRCH, LLP |
| 8110 GATEHOUSE ROAD, SUITE 100 EAST |
| P.O. BOX 747 |
| FALLS CHURCH, VA 22040-0747 |
|
|
Search Results as of:
05/28/2024 07:18 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
