Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10537840
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Filing Dt:
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06/07/2005
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Publication #:
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Pub Dt:
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11/02/2006
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Inventors:
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Meng Fei Koh, Choon Siong Poh, Teck Leong Neo, Theng Wei Leong, Bing Wang
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Title:
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Perforated plate for wafer chuck
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 70 PASIR RIS INDUSTRIAL DRIVE 1 |
| SINGAPORE 519527 |
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| HARNESS, DICKEY & PIERCE, P.L.C. |
| MATTHEW L. CUTLER |
| 7700 BONHOMMEE, SUITE 400 |
| ST. LOUIS, MO 63105 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 70, PASIR RIS INDUSTRIAL DRIVE 1 |
| SINGAPORE, SINGAPORE 519527 |
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| MATTHEW L. CUTLER |
| HARNESS DICKEY & PIERCE, P.L.C. |
| 7700 BONHOMME, SUITE 400 |
| ST. LOUIS, MO 63105 |
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