Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11416036
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Filing Dt:
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05/02/2006
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Publication #:
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Pub Dt:
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11/02/2006
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Inventor:
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Tetsuya Hamada
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Title:
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Substrate processing apparatus
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| TENJINKITA-CHO, 1-1, TERANOUCHI-AGARU 4-CHOME, HORIKAWA-DORI |
| KAMIGYO-KU, KYOTO 602-8585, JAPAN |
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| OSTROLENK, FABER, GERB & SOFFEN, LLP |
| 1180 AVENUE OF THE AMERICAS |
| NEW YORK, NEW YORK 10036-8403 |
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