Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10540992
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Filing Dt:
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06/05/2006
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Publication #:
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Pub Dt:
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11/02/2006
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Inventors:
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Jea Gun Park, Un Gyu Paik, Takeo Katoh, Jin Hyung Park
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Title:
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Chemical-mechanical-polishing slurry composition, method for planarizing surface of semiconductor device using the same, and method for controlling selection ratio of slurry composition
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-1, SHIBAURA 1-CHOME, MINATO-KU |
| TOKYO, JAPAN |
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| 17 HAENGDANG 1-DONG, SEONGDONG-GU |
| SEOUL, KOREA, REPUBLIC OF |
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| JEFFREY D. KARCESKI |
| 1650 TYSONS BOULEVARD |
| MCLEAN, VA 22102 |
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