Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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12/25/2007
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Application #:
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11206843
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Filing Dt:
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08/19/2005
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Publication #:
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Pub Dt:
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11/09/2006
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Inventors:
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Kuo-Hsien Liao, Jia-Yang Chen, Chuei-Tang Wang
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Title:
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MINIATURIZED MULTI-CHIP MODULE AND METHOD FOR MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 141, LANE 351, SEC. 1, TAI-PING RD. |
| TSAO-TUN CHEN, NAN-TOU HSIEN, TAIWAN |
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| THOMAS H. JACKSON |
| 11TH FLOOR |
| 1001 G STREET, N.W. |
| WASHINGTON, DC 20001 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3F., BLD. 1, NO. 2300, JIN KE ROAD |
| PUDONG NEW AREA |
| SHANGHAI, CHINA 201203 |
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| BROWDY AND NEIMARK, PLLC |
| 624 NINTH STREET, N.W. |
| SUITE 300 |
| WASHINGTON, DC 20001 |
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