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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
11413594
Filing Dt:
04/28/2006
Publication #:
Pub Dt:
11/16/2006
Inventors:
Hitoshi Hoshino, Kenji Furuta, Ryugo Oba
Title:
Wafer laser processing method and laser beam processing machine
Assignment: 1
Reel/Frame:
018027/0511Recorded: 06/21/2006Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/08/2006
Exec Dt:
06/08/2006
Exec Dt:
06/08/2006
Assignee:
13-11, OMORI-KITA 2-CHOME
OTA-KU, TOKYO 143-8580, JAPAN
Correspondent:
MICHAEL A. MAKUCH
SMITH GAMBRELL & RUSSELL, LLP
1850 M STREET, NW
SUITE 800
WASHINGTON, DC 20036

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