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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
10537211
Filing Dt:
03/20/2006
Publication #:
Pub Dt:
11/16/2006
Inventor:
Uwe Schwarz
Title:
Production of microelectromechanical systems (mems) using the high-temperature silicon fusion bonding of wafers
Assignment: 1
Reel/Frame:
018541/0430Recorded: 11/21/2006Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
09/13/2006
Assignee:
HAARBERGSTR. 67
ERFURT, GERMANY 99097
Correspondent:
STEPHAN P. GRIBOK
DUANE MORRIS, LLP
30 SOUTH 17TH STREET
PHILADELPHIA, PA 19103-4196

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