Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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04/15/2008
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Application #:
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11492933
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Filing Dt:
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07/26/2006
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Publication #:
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Pub Dt:
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11/23/2006
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Inventors:
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Toshihisa Tanaka, Atsushi Tanaka, Takeshi Soma
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Title:
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POLISHING PAD SURFACE SHAPE MEASURING INSTRUMENT, METHOD OF USING POLISHING PAD SURFACE SHAPE MEASURING INSTRUMENT, METHOD OF MEASURING APEX ANGLE OF CONE OF POLISHING PAD, METHOD OF MEASURING DEPTH OF GROOVE OF POLISHING PAD, CMP POLISHER, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-3, MARUNOUCHI 3-CHOME, CHIYODA-KU |
| TOKYO, JAPAN |
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| 11-1, HANEDA-ASAHI-CHO, OHTA-KU |
| TOKYO, JAPAN |
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| ROBERT J. GAYBRICK |
| MORGAN, LEWIS & BOCKIUS LLP |
| 1111 PENNSYLVANIA AVENUE, N.W. |
| WASHINGTON, DC 20004 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-3, MARUNOUCHI 3-CHOME, CHIYODA-KU |
| TOKYO, JAPAN |
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| ROBERT J. GAYBRICK |
| 1111 PENNSYLVANIA AVENUE, NW |
| MORGAN, LEWIS & BOCKIUS LLP |
| WASHINGTON, DC 20004 |
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