Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/13/2008
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Application #:
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11130662
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Filing Dt:
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05/17/2005
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Publication #:
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Pub Dt:
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11/23/2006
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Inventor:
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Akira Matsunami
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Title:
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METHOD AND APPARATUS FOR ATTACHING AN IC PACKAGE TO A PCB ASSEMBLY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| P.O. BOX 655474, M/S 3999 |
| DALLAS, TEXAS 75265 |
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| WADE JAMES BRADY III |
| TEXAS INSTRUMENTS INCORPORATED |
| P.O. BOX 655474 |
| M/S 3999 |
| DALLAS, TX 75265 |
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