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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
7717768
Issue Dt:
05/18/2010
Application #:
11433701
Filing Dt:
05/11/2006
Publication #:
20060264157
Pub Dt:
11/23/2006
Inventors:
Tomohiro Hashii, Katsuhiko Murayama, Sakae Koyata, Kazushige Takaishi
Title:
WAFER POLISHING APPARATUS AND METHOD FOR POLISHING WAFERS
Assignment: 1
Reel/Frame:
018130/0147Recorded: 07/27/2006Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
HASHII, TOMOHIRO
Exec Dt:
07/14/2006
MURAYAMA, KATSUHIKO
Exec Dt:
07/14/2006
KOYATA, SUKAE
Exec Dt:
07/14/2006
TAKAISHI, KAZUSHIGE
Exec Dt:
07/14/2006
Assignee:
SUMCO CORPORATION
2-1, SHIBAURA 1-CHOME
MINATO-KU, TOKYO, JAPAN
Correspondent:
ANTON E. SKAUGSET
KOLISCH HARTWELL, P.C.
520 S.W. YAMHILL STREET, SUITE 200
PORTLAND, OR 97204
Assignment: 2
Reel/Frame:
018630/0600Recorded: 12/12/2006Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
HASHII, TOMOHIRO
Exec Dt:
07/14/2006
MURAYAMA, KATSUHIKO
Exec Dt:
07/14/2006
KOYATA, SAKAE
Exec Dt:
07/14/2006
TAKAISHI, KAZUSHIGE
Exec Dt:
07/14/2006
Assignee:
SUMCO CORPORATION
2-1, SHIBAURA 1-CHOME
MINATO-KU, TOKYO, JAPAN
Correspondent:
ANTON E. SKAUGSET
KOLISCH HARTWELL, P.C.
520 S.W. YAMHILL STREET, SUITE 200
PORTLAND,OREGON 97204

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