Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11433843
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Filing Dt:
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05/11/2006
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Publication #:
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Pub Dt:
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11/23/2006
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Inventors:
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Tomohiro Hashii, Katsuhiko Murayama, Sakae Koyata, Kazushige Takaishi
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Title:
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Apparatus for polishing wafer and process for polishing wafer
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-1, SHIBAURA 1-CHOME |
| MINATO-KU, TOKYO, JAPAN |
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| ANTON E. SKAUGSET |
| KOLISCH & HARTWELL, P.C. |
| 520 S.W. YAMHILL STREET |
| SUITE 200 |
| PORTLAND, OREGON 97204 |
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