Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11444068
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Filing Dt:
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05/31/2006
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Publication #:
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Pub Dt:
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11/30/2006
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Inventors:
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Hideki Ogawa, Kuniyasu Hosoda
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Title:
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Semiconductor device, semiconductor device mounting board, and method for mounting semiconductor device
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, SHIBAURA 1-CHOME, MINATO-KU |
| TOKYO, JAPAN 105-8001 |
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| MICHAEL S. OKAMOTO |
| 2040 MAIN STREET |
| 14TH FLOOR |
| IRVINE, CA 92614 |
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