Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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02/24/2009
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Application #:
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11505046
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Filing Dt:
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08/16/2006
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Publication #:
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Pub Dt:
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12/07/2006
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Inventors:
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Yaping Hua, Zongya Li, Yang Zhao
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Title:
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METHOD OF WAFER-LEVEL PACKAGING USING LOW-ASPECT RATIO THROUGH-WAFER HOLES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SUITE 202, 800 TURNPIKE STREET |
| NORTH ANDOVER, MASSACHUSETTS 01845 |
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| WENGARTEN, SCHURGIN ET AL. |
| TEN POST OFFICE SQUARE |
| BOSTON, MA 02109 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE'S STATE OF INCORPORATION PREVIOUSLY RECORDED AT REEL: 018283 FRAME: 0221. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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| 800 TURNPIKE STREET |
| SUITE 202 |
| NORTH ANDOVER, MASSACHUSETTS 01845 |
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| PRETI FLAHERTY BELIVEAU & PACHIOS LLP |
| 60 STATE STREET |
| BOSTON, MA 02109 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ROOM 501, BUILDING 4, FINANCIAL CENTER, NO.158 |
| WEST THIRD ROAD, TIANJIN AIRPORT ECONOMIC AREA |
| TIANJIN, CHINA |
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| ECOTECH LAW GROUP, P.C. |
| THE HEARST BUILDING, 5 THIRD STREET |
| SUITE 700 |
| SAN FRANCISCO, CA 94103 |
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