Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11373635
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Filing Dt:
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03/09/2006
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Publication #:
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Pub Dt:
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12/21/2006
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Inventors:
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Hooman Hafezi, Aron Rosenfeld, Zhi-Wen Sun, Hua Chung, Lei Zhu
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Title:
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Method of direct plating of copper on a ruthenium alloy
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3050 BOWERS AVENUE |
| SANTA CLARA, CALIFORNIA 95054 |
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| B. TODD PATTERSON |
| 3040 POST OAK BLVD., SUITE 1500 |
| HOUSTON, TX 77056-6582 |
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