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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
NONE
Issue Dt:
Application #:
11158795
Filing Dt:
06/21/2005
Publication #:
Pub Dt:
12/21/2006
Inventors:
Arvind S. Salian, Hemant D. Desai, Stephen R. Hooper, William G. McDonald
Title:
Method of making a substrate contact for a capped MEMS at the package level
Assignment: 1
Reel/Frame:
016719/0032Recorded: 06/21/2005Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/15/2005
Exec Dt:
06/15/2005
Exec Dt:
06/15/2005
Exec Dt:
06/15/2005
Assignee:
6501 WILLIAMS CANNON DRIVE WEST
AUSTIN, TEXAS 78735
Correspondent:
CINDY H. KWACALA
INGRASSIA FISHER & LORENZ, P.C.
7150 E. CAMELBACK RD., STE. 325
SCOTTSDALE, AZ 85251
Assignment: 2
Reel/Frame:
018855/0129Recorded: 02/02/2007Pages: 450
Conveyance:
SECURITY AGREEMENT
Assignors:
Exec Dt:
12/01/2006
Exec Dt:
12/01/2006
Exec Dt:
12/01/2006
Exec Dt:
12/01/2006
Assignee:
390 GREENWICH STREET
NEW YORK, NEW YORK 10013
Correspondent:
CBCINNOVIS DBA FEDERAL RESEARCH
1023 FIFTEENTH STREET, NW, STE 401
ATTN: OLEH HERELIUK
WASHINGTON, DC 20005
Assignment: 3
Reel/Frame:
037354/0225Recorded: 12/21/2015Pages: 373
Conveyance:
PATENT RELEASE
Assignor:
Exec Dt:
12/07/2015
Assignee:
6501 WILLIAM CANNON DRIVE WEST
AUSTIN, TEXAS 78735
Correspondent:
IP RESEARCH PLUS, INC.
21 TADCASTER CIRCLE
ATTN: PENELOPE J.A. AGODOA
WALDORF, MD 20602

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