Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10538584
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Filing Dt:
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03/09/2006
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Publication #:
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Pub Dt:
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12/21/2006
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Inventor:
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Toshiharu Takayama
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Title:
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Flip-chip mounting electronic component and method for producing the same, circuit board and method for producing the same, method for producing package
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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3672 OOAZA INA, INA-SHI, |
NAGANO 396-0021, JAPAN |
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MARK MONTAGUE |
COWAN, LIEBOWITZ & LATMAN, P.C |
1133 AVENUE OF AMERICAS |
NEW YORK, NY 10036 |
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05/14/2024 02:50 PM
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