Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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03/24/2009
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Application #:
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11174495
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Filing Dt:
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07/06/2005
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Publication #:
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Pub Dt:
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01/11/2007
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Inventor:
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Avraham Meir
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Title:
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METHOD OF SELLING INTEGRATED CIRCUIT DIES FOR MULTI-CHIP PACKAGES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| CENTRAL PARK 2000 |
| ATIR YEDA 7 |
| KFAR SABA, ISRAEL 44425 |
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| MARK M. FRIEDMAN |
| C/O BILL POLKINGHORN |
| DISCOVERY DISPATCH, 9003 FLORIN WAY |
| UPPER MARLBORO, MD 20772 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 7 ATIR YEDA STREET |
| KFAR SABA, ISRAEL 44425 |
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| SANDISK |
| 601 MCCARTHY BOULEVARD |
| PATENT DEPARTMENT/SIMONA BENJAMIN |
| MILPITAS, CA 95035 |
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Assignment:
3
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 7 ATIR YEDA STREET |
| KFAR SABA, ISRAEL 44425 |
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| SANDISK |
| 601 MCCARTHY BOULEVARD |
| PATENT DEPARTMENT/SIMONA BENJAMIN |
| MILPITAS, CA 95035 |
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Assignment:
4
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 8 ATIREI YEDA |
| KFAR SABA, ISRAEL 4464308 |
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| WESTERN DIGITAL TECHNOLOGIES |
| 951 SANDISK DRIVE |
| LEGAL DEP./SIMONA BENJAMIN |
| MILPITAS, CA 95035 |
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