Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/14/2008
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Application #:
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11302736
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Filing Dt:
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12/13/2005
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Publication #:
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Pub Dt:
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01/18/2007
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Inventors:
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Yu-Tang Pan, Cheng-Ting Wu, Shih-Wen Chou, Hui-Ping Liu
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Title:
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CHIP PACKAGE WITHOUT CORE AND STACKED CHIP PACKAGE STRUCTURE THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 1, R&D 1ST RD., |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN R.O.C. |
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| CANON'S COURT, 22 VICTORIA STREET |
| HAMILTON HM12,, BERMUDA |
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| J.C. PATENTS, INC. |
| 4 VENTURE, SUITE 250 |
| IRVINE, CA 92618 |
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