Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11248770
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Filing Dt:
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10/11/2005
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Publication #:
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Pub Dt:
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01/18/2007
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Inventor:
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Chi-Hsing Hsu
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Title:
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Die pad arrangement and bumpless chip package applying the same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8F, NO. 535, CHUNG-CHENG RD. |
| HSIN-TIEN CITY |
| TAIPEI HSIEN, TAIWAN R.O.C. |
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| J. C. PATENTS, INC. |
| 4 VENTURE, SUITE 250 |
| IRVINE, CA 92618 |
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