Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11486589
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Filing Dt:
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07/14/2006
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Publication #:
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Pub Dt:
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01/25/2007
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Inventor:
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Jafry Bin Abdul Wahid
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Title:
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Method and apparatus for providing a solder area on a leadframe
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ST.-MARTIN-STR. 53 |
| 81669 MUNICH, GERMANY |
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| JASON M. WEJNERT |
| P.O. BOX 10395 |
| CHICAGO, IL 60610 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 506 SOUTH WRIGHT STREET |
| 352 HENRY ADMINISTRATION BUILDING |
| URBANA, ILLINOIS 61801 |
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| LEE & HAYES, PLLC |
| 421 W RIVERSIDE AVE STE 500 |
| SPOKANE, WA 99201 |
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