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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
11443230
Filing Dt:
05/30/2006
Publication #:
Pub Dt:
01/25/2007
Inventors:
Hiroyuki Suzuki, Satoru Sekiguchi, Timothy D. Krizan
Title:
Resin compositions with a low coefficient of thermal expansion and articles therefrom
Assignment: 1
Reel/Frame:
018502/0835Recorded: 11/09/2006Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/25/2006
Exec Dt:
09/25/2006
Exec Dt:
09/20/2006
Assignee:
1007 MARKET STREET
LEGAL-PATENTS
WILMINGTON, DELAWARE 19898
Correspondent:
KEVIN S. DOBSON
4417 LANCASTER PIKE
LEGAL-PATENTS
WILMINGTON, DE 19805

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